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Tungsten (also called wolfram) [14] [15] is a chemical element; ... In electronics, tungsten is used as an interconnect material in integrated circuits, ...
The earliest metal–semiconductor diodes in electronics application occurred around 1900, when the cat's whisker rectifiers were used in receivers. [12] They consisted of pointed tungsten wire (in the shape of a cat's whisker) whose tip or point was pressed against the surface of a galena (lead sulfide) crystal.
Formation of HF is a drawback, as the HF vapor is very aggressive and etches away most materials. Also, the deposited tungsten shows poor adhesion to the silicon dioxide which is the main passivation material in semiconductor electronics. Therefore, SiO 2 has to be covered with an extra buffer layer prior to the tungsten deposition. On the ...
Global interconnects can transmit further, such as over large-area sub-circuits. Consequently, local interconnects may be formed from materials with relatively high electrical resistivity such as polycrystalline silicon (sometimes silicided to extend its range) or tungsten. To extend the distance an interconnect may reach, various circuits such ...
The various metal layers are interconnected by etching holes (called "vias") in the insulating material and then depositing tungsten in them with a CVD technique using tungsten hexafluoride; this approach can still be (and often is) used in the fabrication of many memory chips such as dynamic random-access memory (DRAM), because the number of ...
Tungsten, for example, still made the list in both metallic and carbide forms. Diamond, graphite, boron nitride joined that list, as did transition metals like molybdenum, tantalum, and rhenium.
By coating the tungsten with a substance of lower work function (e.g., thorium or barium oxide), the emission can be greatly increased. This prolongs the lifetime of the filament by allowing operation at lower temperatures (for more information, see hot cathode). Band bending models in solid-state electronics
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