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In computer hardware, a CPU socket or CPU slot contains one or more mechanical components providing mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows for placing and replacing the central processing unit (CPU) without soldering.
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors . A BGA can provide more interconnection pins than can be put on a dual in-line or flat package .
In an automobile, ball joints are spherical bearings that connect the control arms to the steering knuckles. They are used on virtually every automobile made [4] and work similarly to the ball-and-socket design of the human hip joint. [5] A ball joint consists of a bearing stud and socket enclosed in a casing; all these parts are made of steel ...
LGA 2011, also called Socket R, is a CPU socket by Intel released on November 14, 2011. It launched along with LGA 1356 to replace its predecessor, LGA 1366 (Socket B) and LGA 1567. [1] [2] While LGA 1356 was designed for dual-processor or low-end servers, LGA 2011 was designed for high-end desktops and high-performance servers. The socket has ...
This type of packaging uses a ceramic substrate with pins arranged in a pin grid array. Some CPUs that use CPGA packaging are the AMD Socket A Athlons and the Duron. A CPGA was used by AMD for Athlon and Duron processors based on Socket A, as well as some AMD processors based on Socket AM2 and Socket AM2+. While similar form factors have been ...
LGA 1700 socket on a motherboard. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]
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