Ad
related to: best practices for bga solder machine
Search results
Results from the WOW.Com Content Network
A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip. Cross-cut section of BGA mounted circuit. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors.
Dye-n-Pry is a useful failure analysis technique to detect cracking or open circuits in BGA solder joints. [2] This has some practical advantages over other destructive techniques, such as cross sectioning, as it can inspect a full ball grid array which may consist of hundreds of solder joints. Cross sectioning, on the other hand, may only be ...
Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...
Low-profile fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm; Micro ball grid array : Ball spacing less than 1 mm; Thin fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux. [2] A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. [3] Ball grid array, chip-scale package, and flip chip packages generally use solder balls.
A simple wave soldering machine. There are many types of wave solder machines; however, the basic components and principles of these machines are the same. The basic equipment used during the process is a conveyor that moves the PCB through the different zones, a pan of solder used in the soldering process, a pump that produces the actual wave ...
The logic package is on the bottom because it needs many more BGA connections to the motherboard. Typical logic plus memory PoP stack, common to mobile phone SoCs or baseband modems from 2005 onward. During PCB assembly, the bottom package of a PoP stack is placed directly on the PCB, and the other package(s) of the stack are stacked on top.
BGA components are particularly susceptible to failures induced by thermal shock due to the mechanical stresses exerted on solder joints during rapid temperature changes. Research has shown that thermal shock can lead to the initiation and propagation of cracks within these solder joints, compromising the integrity and reliability of electronic ...
Ad
related to: best practices for bga solder machine