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The BGA is a solution to the problem of producing a miniature package for an integrated circuit with many hundreds of pins. Pin grid arrays and dual-in-line surface mount packages were being produced with more and more pins, and with decreasing spacing between the pins, but this was causing difficulties for the soldering process.
A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC.. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.
However, industry leaders Intel and AMD transitioned in the 2000s from PGA packages to land grid array (LGA) packages. [8] Ball grid array (BGA) packages have existed since the 1970s, but evolved into flip-chip ball grid array (FCBGA) packages in the 1990s. FCBGA packages allow for much higher pin count than any existing package types.
Flat no-lead packages usually, but not always, include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad. [2] The QFN package is similar to the quad-flat package (QFP), and a ball grid array (BGA).
Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The ...
The logic package is on the bottom because it needs many more BGA connections to the motherboard. Typical logic plus memory PoP stack, common to mobile phone SoCs or baseband modems from 2005 onward During PCB assembly , the bottom package of a PoP stack is placed directly on the PCB, and the other package(s) of the stack are stacked on top.
The standard [2] includes multiple package variants: [3] [4] DO-214AA, also known as SMB, [ 5 ] is the middle size. DO-214AB, also known as SMC, [ 6 ] is the largest size.
In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, [1] and may or may not cover the entire underside of the package. PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket.