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Mitre 10 is an Australian retail and trade hardware store chain. Operations are based on a cooperative system, where the store owners are members of the national group and each has voting rights. The chain name references the mitre joint . [ 3 ]
In the late 1980s the chain expanded its to include home and garden products. In 1994 the "Mitre 10 Home and Trade" brand was established. Two brand names (Hammer Hardware, Mitre 10 Mega) further expanded the Mitre 10 presence in both the small and large towns and cities. There were 50 Mitre 10 stores in 1999, [6] 113 in 2003 and 83 in 2019. [7 ...
MITRE was founded in Bedford, Massachusetts in 1958, [6] spun off from the MIT Lincoln Laboratory. [7] MITRE's first employees had been developing the Semi-Automatic Ground Environment (SAGE) system and aerospace defense as part of Lincoln Labs Division 6. They were specifically engaged in MIT's research and engineering of the project.
A flatpack integrated circuit on a circuit board, among TO-5 packages. The original flatpack was invented by Y. Tao in 1962 while he was working for Texas Instruments to improve heat dissipation. The dual in-line package was invented two years later. The first devices measured 1/4 inch by 1/8 inch (3.2 mm by 6.4 mm) and had 10 leads. [1]
Plastic quad flat-pack , a square with pins on all four sides, 44 or more pins; Ceramic quad flat-pack : similar to PQFP; Metric quad flat-pack : a QFP package with metric pin distribution; Thin quad flat-pack , a thinner version of LQFP; Quad flat no-lead : smaller footprint than leaded equivalent
In June 2011, Mitre extended its deal with the Scottish Premier League to be the official ball supplier until 2015. [10] In 2015 Mitre released their new Hyperseam technology, [11] which will grace The Football League and Scottish Premier League for years to come as they both announced new sponsorship deals for Mitre to continue being the ...
The quad flat-pack has connections only around the periphery of the package. To increase the number of pins, the spacing was decreased from 50 mil (as found on small outline packages) to 20 and later 12 (1.27 mm, 0.51 mm and 0.30 mm respectively).
In the late 1990s, plastic quad flat pack (PQFP) and thin small-outline packages (TSOP) replaced PGA packages as the most common for high pin count devices, [1] though PGA packages are still often used for microprocessors. However, industry leaders Intel and AMD transitioned in the 2000s from PGA packages to land grid array (LGA) packages. [8]