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Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS ...
The procedural steps of the direct bonding process of wafers any surface is divided into wafer preprocessing, pre-bonding at room temperature and; annealing at elevated temperatures. Even though direct bonding as a wafer bonding technique is able to process nearly all materials, silicon is the most established material up to now. Therefore, the ...
Adhesive bonding has the advantage of relatively low bonding temperature as well as the absence of electric voltage and current. Because the wafers are not in direct contact, this procedure enables the use of different substrates, such as silicon, glass, metals or other semiconductor materials.
In electronics, a wafer (also called a slice or substrate) [1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon
wafer-to-wafer (also wafer-on-wafer) stacking – bonding and integrating whole processed wafers atop one another before dicing the stack into dies; wire bonding – using tiny wires to interconnect an IC or other semiconductor device with its package (see also thermocompression bonding, flip chip, hybrid bonding, etc.) WLP – see wafer-level ...
Wafer backgrinding and polishing [133] (reduces the thickness of the wafer for thin devices like a smartcard or PCMCIA card or wafer bonding and stacking, this can also occur during wafer dicing, in a process known as Dice Before Grind or DBG [134] [135]) Wafer bonding and stacking (for three-dimensional integrated circuits and MEMS)
Wafer bond characterization refers to the process of evaluating the quality and strength of a bond between two semiconductor wafers. The wafer bond characterization is based on different methods and tests. Considered a high importance of the wafer are the successful bonded wafers without flaws.
Wafer bonding is a packaging technology for materials integration as well as for hermetic sealing and encapsulation. This method describes the process for all ...
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