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186 etched glass at Bankfield Museum. Glass etching, or " French embossing ", is a popular technique developed during the mid-1800s that is still widely used in both residential and commercial spaces today. Glass etching comprises the techniques of creating art on the surface of glass by applying acidic, caustic, or abrasive substances.
Copper(II) sulfate is an inorganic compound with the chemical formula Cu SO 4.It forms hydrates CuSO 4 ·nH 2 O, where n can range from 1 to 7. The pentahydrate (n = 5), a bright blue crystal, is the most commonly encountered hydrate of copper(II) sulfate, [10] while its anhydrous form is white. [11]
A solution of nitric acid, water and alcohol, nital, is used for etching metals to reveal the microstructure. ISO 14104 is one of the standards detailing this well known procedure. [46] Nitric acid is used either in combination with hydrochloric acid or alone to clean glass cover slips and glass slides for high-end microscopy applications. [47]
Aqua regia (/ ˈreɪɡiə, ˈriːdʒiə /; from Latin, "regal water" or "royal water") is a mixture of nitric acid and hydrochloric acid, optimally in a molar ratio of 1:3. [b] Aqua regia is a fuming liquid. Freshly prepared aqua regia is colorless, but it turns yellow, orange or red within seconds from the formation of nitrosyl chloride and ...
Sodium treated PTFE will degrade with exposure to UV radiation. Immediately after sodium treatment, the PTFE surface is dark brown. The weaker the etching solution, the lighter the color change and the weaker the bond will be. [1] When exposed to UV radiation, the treated PTFE will gradually return to its original white color.
Buffered oxide etch (BOE), also known as buffered HF or BHF, is a wet etchant used in microfabrication. It is a mixture of a buffering agent, such as ammonium fluoride NH4F, and hydrofluoric acid (HF). Its primary use is in etching thin films of silicon nitride (Si 3 N 4) or silicon dioxide (SiO 2), by the reaction: SiO2 + 4HF + 2NH4F → (NH4 ...
Piranha solution, also known as piranha etch, is a mixture of sulfuric acid (H2SO4) and hydrogen peroxide (H2O2). The resulting mixture is used to clean organic residues off substrates, for example silicon wafers. [1] Because the mixture is a strong oxidizing agent, it will decompose most organic matter, and it will also hydroxylate most ...
Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which ...