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A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.
These walls commonly form part of the device enclosure. The large holes in the via fences seen in figures 1 and 5 are screw holes for clamping these walls in place. The wall casting belonging to this circuit is shown in figure 3. [5] Figure 4. Via hole equivalent circuit. The design of the fence needs to consider the size and spacing of the vias.
Ogunjimi et al. [9] looked at the effect of manufacturing and design process variables on the fatigue life of microvias, including trace (conductor) thickness, layer or layers of the dielectric around the trace and in the microvia, via geometry, via wall angle, ductility coefficient of the conductor material, and strain concentration factor ...
A PCB milling machine (referred to as a 'PCB Prototyper') operates in a similar way to a plotter, receiving commands from the host software that control the position of the milling head in the x, y, and (if relevant) z axis. Laser resist ablation involves spraying black paint onto copper clad laminate, then placing the board into CNC laser ...
Through-hole technology uses holes drilled through the printed circuit board (PCB) for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB. Three 14-pin (DIP14) plastic dual in-line packages containing IC chips.
In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits.
In October 2001, VIA announced their decision to create a new motherboard division, to provide standardized infrastructure for lower-cost PC iterations, and focus on embedded devices. The result was the November 2001 release of the VT6010 Mini-ITX reference design (again by Robert Kuo), once again touted as an "Information PC", or low cost ...
A substrate-integrated waveguide (SIW) (also known as post-wall waveguide or laminated waveguide) is a synthetic rectangular electromagnetic waveguide formed in a dielectric substrate by densely arraying metallized posts or via holes that connect the upper and lower metal plates of the substrate.
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