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One or more pipes extend upward into some sort of radiator or similar heat dissipation area, and this is all set up such that the CPU heats the reservoir and liquid it contains, which begins boiling, and the vapor travels up the tube(s) into the radiator/heat dissipation area, and then after condensing, drips back down into the reservoir, or ...
Failed IC in a laptop. Wrong input polarity has caused massive overheating of the chip and burned the plastic casing. Electronic components have a wide range of failure modes. These can be classified in various ways, such as by time or cause.
Loss of fluid and electrolytes cause heat cramps – slow muscular contraction and severe muscular spasm lasting between one and three minutes. Almost all cases of heat cramps involve vigorous physical exertion. Body temperature may remain normal or a little higher than normal and cramps are concentrated in heavily used muscles.
Overheating is a phenomenon of rising temperatures in an electrical circuit. Overheating causes damage to the circuit components and can cause fire, explosion, and injury. Damage caused by overheating is usually irreversible; the only way to repair it is to replace some components.
An active laptop cooler. A laptop/notebook cooler, cooling pad, cooler pad or chill mat is an accessory for laptop computers intended to reduce their operating temperature when the laptop is unable to sufficiently cool itself. Laptop coolers are intended to protect both the laptop from overheating and the user from suffering heat related ...
Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).
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A heat sink usually consists of a metal structure with one or more flat surfaces to ensure good thermal contact with the components to be cooled, and an array of comb or fin like protrusions to increase the surface contact with the air, and thus the rate of heat dissipation.