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LGA 1150, [1] also known as Socket H3, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for CPUs built on the Haswell microarchitecture. This socket is also used by the Haswell's successor, Broadwell microarchitecture.
CPUs with an LGA (land grid array) package are inserted into the socket, the latch plate is flipped into position atop the CPU, and the lever is lowered and locked into place, pressing the CPU's contacts firmly against the socket's lands and ensuring a good connection, as well as increased mechanical stability.
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LGA 1150 DMI 2.0 June 2013 CM8064601467601; $250 Xeon E3-1240L v3: SR1T8 (C0) 4 ... Support for up to 12 DIMMs of DDR4 memory per CPU socket (E5-2629 v3, ...
LGA 1156 LGA 1155 LGA 1150 LGA 1151 LGA 1200 LGA 1700: Intel 7, 14 nm, 22 nm, 32 nm, 45 nm, 65 nm 2.9 W – 73 W 1 or 2, 2 /w hyperthreading 800 MHz, 1066 MHz, 2.5GT/s, 5 GT/s 64 KiB per core 2x256 KiB – 2 MiB 0 KiB – 3 MiB Intel Core: Txxxx Lxxxx Uxxxx Yonah: 2006–2008 1.06 GHz – 2.33 GHz Socket M: 65 nm 5.5 W – 49 W 1 or 2
LGA 1700 socket on a motherboard. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]
Desktop version (LGA 1150 socket and the LGA 2011-v3 socket): Haswell-DT; Mobile/Laptop version (PGA socket): Haswell-MB; BGA version: 47 W and 57 W TDP classes: Haswell-H (for "All-in-one" systems, Mini-ITX form factor motherboards, and other small footprint formats) 13.5 W and 15 W TDP classes : Haswell-ULT (for Intel's UltraBook platform)
Socket 370, also known as PGA370, is a CPU socket first used by Intel for Pentium III and Celeron processors to first complement and later replace the older Slot 1 CPU interface on personal computers. The "370" refers to the number of pin holes in the socket for CPU pins. Socket 370 was replaced by Socket 423 in 2000.
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