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In April 2020, AMD launched three new SKUs using Epyc's 7nm Rome platform. The three processors introduced were the eight-core Epyc 7F32, the 16-core 7F52 and the 24-core 7F72, featuring base clocks up to 3.7 GHz (up to 3.9 GHz with boost) within a TDP range of 180 to 240 watts.
Common place to discuss layout and style of the Zen CPU tables at: Talk:List of AMD Ryzen processors. You can edit this template with the VisualEditor . ^ a b c "New 2nd Gen AMD EPYC™ Processors Redefine Performance for Database, Commercial HPC and Hyperconverged Workloads" .
AMD Zen 3+ Family 19h – 2022 revision of Zen 3 used in Ryzen 6000 mobile processors using a 6 nm process. AMD Zen 4 Family 19h – fourth generation Zen architecture, in 5 nm process. [5] Used in Ryzen 7000 consumer processors on the new AM5 platform with DDR5 and PCIe 5.0 support. Adds support for AVX-512 instruction set.
Advanced Micro Devices' (AMD) third-generation EPYC processors are expected to bolster the chipmaker's prospects in the server processor market.
EPYC Embedded 3001 series 4/8/12/16 No 1500–2100 (2150–3100 all) (2900–3100 boost) 8–32 MB (8 MB per CCX) Socket SP4r2: Dual-channel DDR4: EPYC Embedded 3051 series Yes 1900–2700 (2450–3100 all) (2900–3100 boost) 16–32 MB (8 MB per CCX) Great Horned Owl Ryzen Embedded V1000 series 2/4 Yes 2000–3350 (3200–3800 boost) 4 MB ...
If applicable and openly known, the designation(s) of each processor's core (versions) is (are) listed in parentheses. For an overview over concrete product, you then need to consult further articles, like e.g. list of AMD accelerated processing units .
Common features: SP3 socket; Zen microarchitecture; GloFo 14 nm process; MCM with four System-on-a-chip (SOC) dies, two core complexes (CCX) per SOC die [1]; Eight-channel DDR4-2666 (the 7251 model is limited to DDR4-2400)
The Epyc server line of chips based on Zen 3 is named Milan and is the final generation of chips using the SP3 socket. [6] Epyc Milan was released on March 15, 2021. [65] Common features: SP3 socket; Zen 3 microarchitecture; TSMC 7 nm process for the compute and cache dies, GloFo 14 nm process for the I/O die
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