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  2. Coupon (PWB) - Wikipedia

    en.wikipedia.org/wiki/Coupon_(PWB)

    A coupon or test coupon is a printed circuit board (PCB) used to test the quality of a printed wiring board (PWB) fabrication process. Test coupons are fabricated on the same panel as the PWBs, typically at the edges. Coupons are then inspected to ensure proper layer alignment, electrical connectivity, and cross sectioned to inspect internal ...

  3. Solid Logic Technology - Wikipedia

    en.wikipedia.org/wiki/Solid_Logic_Technology

    Solid Logic Dense (SLD) increased packaging density and circuit performance by mounting the discrete transistors and diodes on top of the substrate and the resistors on the bottom. [3]: 15 SLD voltages were the same as SLT. Unit Logic Device (ULD) use flat-pack ceramic packages, much smaller than SLT's metal cans.

  4. Solid-state electronics - Wikipedia

    en.wikipedia.org/wiki/Solid-state_electronics

    The first transistor hi-fi system was developed by engineers at GE and demonstrated at the University of Philadelphia in 1955. [9] In terms of commercial production, The Fisher TR-1 was the first "all transistor" preamplifier, which became available mid-1956. [10] In 1961, a company named Transis-tronics released a solid-state amplifier, the ...

  5. Electronic component - Wikipedia

    en.wikipedia.org/wiki/Electronic_component

    Active components rely on a source of energy (usually from the DC circuit, which we have chosen to ignore) and usually can inject power into a circuit, though this is not part of the definition. [4] Active components include amplifying components such as transistors , triode vacuum tubes (valves), and tunnel diodes .

  6. Integrated circuit packaging - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_packaging

    The other type of packaging used in the 1970s, called the ICP (Integrated Circuit Package), was a ceramic package (sometimes round as the transistor package), with the leads on one side, co-axially with the package axis. Commercial circuit packaging quickly moved to the dual in-line package (DIP), first in ceramic and later in plastic. [5]

  7. TO-220 - Wikipedia

    en.wikipedia.org/wiki/TO-220

    The "TO" designation stands for "transistor outline". [2] TO-220 packages have three leads. Similar packages with two, four, five or seven leads are also manufactured. A notable characteristic is a metal tab with a hole, used to mount the case to a heatsink, [3] allowing the component to dissipate more heat than one constructed in a TO-92 case.

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