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  2. Immersion silver plating - Wikipedia

    en.wikipedia.org/wiki/Immersion_silver_plating

    Immersion silver plating (or IAg plating) is a surface plating process that creates a thin layer of silver over copper objects. It consists in dipping the object briefly into a solution containing silver ions.

  3. Galvanic anode - Wikipedia

    en.wikipedia.org/wiki/Galvanic_anode

    A galvanic anode, or sacrificial anode, is the main component of a galvanic cathodic protection system used to protect buried or submerged metal structures from corrosion. They are made from a metal alloy with a more "active" voltage (more negative reduction potential / more positive oxidation potential) than the metal of the structure. The ...

  4. Black oxide - Wikipedia

    en.wikipedia.org/wiki/Black_oxide

    Black oxide for copper, sometimes known by the trade name Ebonol C, converts the copper surface to cupric oxide. For the process to work the surface has to have at least 65% copper; for copper surfaces that have less than 90% copper it must first be pretreated with an activating treatment. The finished coating is chemically stable and very ...

  5. Galvanic corrosion - Wikipedia

    en.wikipedia.org/wiki/Galvanic_corrosion

    Rhodium-plated on silver-plated copper: −0.05 Silver, solid or plated; monel metal; high nickel-copper alloys: −0.15 Nickel, solid or plated; titanium and its alloys; monel: −0.30 Copper, solid or plated; low brasses or bronzes; silver solder; German silvery high copper-nickel alloys; nickel-chromium alloys: −0.35 Brass and bronzes: −0.40

  6. Cathodic protection - Wikipedia

    en.wikipedia.org/wiki/Cathodic_protection

    Cathodic protection (CP; / k æ ˈ θ ɒ d ɪ k / ⓘ) is a technique used to control the corrosion of a metal surface by making it the cathode of an electrochemical cell. [1] A simple method of protection connects the metal to be protected to a more easily corroded "sacrificial metal" to act as the anode. The sacrificial metal then corrodes ...

  7. Organic solderability preservative - Wikipedia

    en.wikipedia.org/wiki/Organic_Solderability...

    It uses a water-based organic compound that selectively bonds to copper and protects the copper until soldering. Compared to the traditional HASL process, the OSP process is widely used in the electronics manufacturing industry because it does not require high-temperature treatment and significantly reduces the risk of metal corrosion ...

  8. Copper - Wikipedia

    en.wikipedia.org/wiki/Copper

    Cu 2+-SOD + O 2 − → Cu +-SOD + O 2 (reduction of copper; oxidation of superoxide) Cu +-SOD + O 2 − + 2H + → Cu 2+-SOD + H 2 O 2 (oxidation of copper; reduction of superoxide) The protein hemocyanin is the oxygen carrier in most mollusks and some arthropods such as the horseshoe crab (Limulus polyphemus). [199]

  9. Diffusion barrier - Wikipedia

    en.wikipedia.org/wiki/Diffusion_barrier

    It is done to act as a barrier to protect either one of the metals from corrupting the other. [1] Adhesion of a plated metal layer to its substrate requires a physical interlocking, inter-diffusion of the deposit or a chemical bonding between plate and substrate in order to work. The role of a diffusion barrier is to prevent or to retard the ...