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Plasma cutting. Plasma cutting is a process that cuts through electrically conductive materials by means of an accelerated jet of hot plasma. Typical materials cut with a plasma torch include steel, stainless steel, aluminum, brass and copper, although other conductive metals may be cut as well. Plasma cutting is often used in fabrication shops ...
PECVD machine at LAAS technological facility in Toulouse, France. Plasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases.
Plasma modeling. Plasma modeling refers to solving equations of motion that describe the state of a plasma. It is generally coupled with Maxwell's equations for electromagnetic fields or Poisson's equation for electrostatic fields. There are several main types of plasma models: single particle, kinetic, fluid, hybrid kinetic/fluid, gyrokinetic ...
2 "Plasma cutters working near sensitive electronics, such as CNC hardware or computers, use the contact start method. The nozzle and electrode are in contact. The nozzle is the cathode, and the electrode is the anode. When the plasma gas begins to flow, the nozzle is blown forward."
Chinese paper cuttings (2014) Papercutting or paper cutting is the art of paper designs. Art has evolved all over the world to adapt to different cultural styles. One traditional distinction most styles share is that the designs are cut from a single sheet of paper as opposed to multiple adjoining sheets as in collage.
A plasma torch cutter. A plasma torch (also known as a plasma arc, plasma gun, plasma cutter, or plasmatron) is a device for generating a directed flow of plasma. [1][2][3] The plasma jet can be used for applications including plasma cutting, plasma arc welding, plasma spraying, and plasma gasification for waste disposal. [4]
A plasma etcher, or etching tool, is a tool used in the production of semiconductor devices. A plasma etcher produces a plasma from a process gas, typically oxygen or a fluorine -bearing gas, using a high frequency electric field, typically 13.56 MHz. A silicon wafer is placed in the plasma etcher, and the air is evacuated from the process ...
The plasma approximation: The plasma approximation applies when the plasma parameter Λ, [26] representing the number of charge carriers within the Debye sphere is much higher than unity. [ 19 ] [ 20 ] It can be readily shown that this criterion is equivalent to smallness of the ratio of the plasma electrostatic and thermal energy densities.
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