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Fugacity and BCF relate to each other in the following equation: = [6] where Z Fish is equal to the Fugacity capacity of a chemical in the fish, P Fish is equal to the density of the fish (mass/length 3), BCF is the partition coefficient between the fish and the water (length 3 /mass) and H is equal to the Henry's law constant (Length 2 /Time 2) [6]
Bromochlorodifluoromethane (BCF), also referred to by the code numbers Halon 1211 and Freon 12B1, is a haloalkane with the chemical formula C F 2 Cl Br. It is used for fire suppression, especially for expensive equipment or items that could be damaged by the residue from other types of extinguishers. [ 1 ]
Tris (pentafluorophenyl)borane, sometimes referred to as "BCF", is the chemical compound (C6F5)3B. It is a white, volatile solid. The molecule consists of three pentafluorophenyl groups attached in a "paddle-wheel" manner to a central boron atom; the BC3 core is planar. It has been described as the “ideal Lewis acid ” because of its high ...
2N is the number of reversals to failure (N cycles); ε f ' is an empirical constant known as the fatigue ductility coefficient defined by the strain intercept at 2N =1; c is an empirical constant known as the fatigue ductility exponent , commonly ranging from -0.5 to -0.7.
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The Biopharmaceutics Classification System (BCS) is a system to differentiate drugs on the basis of their solubility and permeability. [1] This system restricts the prediction using the parameters solubility and intestinal permeability. The solubility classification is based on a United States Pharmacopoeia (USP) aperture.
In thermodynamics, the Volume Correction Factor (VCF), also known as Correction for the effect of Temperature on Liquid (CTL), is a standardized computed factor used to correct for the thermal expansion of fluids, primarily, liquid hydrocarbons at various temperatures and densities. [1] It is typically a number between 0 and 2, rounded to five ...
Solder fatigue is the mechanical degradation of solder due to deformation under cyclic loading. This can often occur at stress levels below the yield stress of solder as a result of repeated temperature fluctuations, mechanical vibrations, or mechanical loads. Techniques to evaluate solder fatigue behavior include finite element analysis and ...