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  2. ASE Group - Wikipedia

    en.wikipedia.org/wiki/ASE_Group

    According to the research firm Yole Développement, the fan-out packaging market is predicted to reach $2.4 billion by 2020, increasing from $174 million in 2014. [ 12 ] Wafer-level chip-scale packaging (WL-CSP) is the technology that enables the smallest available packages in the market, meeting the increasing demand for smaller and faster ...

  3. Advanced packaging (semiconductors) - Wikipedia

    en.wikipedia.org/wiki/Advanced_packaging...

    Advanced packaging allows multiple devices, including electrical, mechanical, or semiconductor devices, to be merged and packaged as a single electronic device. Advanced packaging uses processes and techniques that are typically performed at semiconductor fabrication facilities , unlike traditional integrated circuit packaging, which does not.

  4. List of semiconductor fabrication plants - Wikipedia

    en.wikipedia.org/wiki/List_of_semiconductor...

    This is a list of semiconductor fabrication plants, factories where integrated circuits (ICs), also known as microchips, are manufactured.They are either operated by Integrated Device Manufacturers (IDMs) that design and manufacture ICs in-house and may also manufacture designs from design-only (fabless firms), or by pure play foundries that manufacture designs from fabless companies and do ...

  5. US plans $75 million grant to Absolics for advanced chip ...

    www.aol.com/news/us-plans-75-million-grant...

    The US Commerce Department said on Thursday it plans to grant $75 million to Absolics for constructing a 120,000-square-foot facility in Georgia that will supply advanced materials to the country ...

  6. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate.

  7. Amkor Technology - Wikipedia

    en.wikipedia.org/wiki/Amkor_Technology

    The company's offers include RF-antenna designs incorporated directly into or onto a chip, [14] CMOS imaging sensors [15] or flip chip packaging with copper pillars bumps. [16] [17] Amkor also offers wire bonding of semiconductors to packages [18] as well as a technology to prevent edge gaps and cracks on semiconductor packaging called "Edge ...

  8. List of companies of the Philippines - Wikipedia

    en.wikipedia.org/wiki/List_of_companies_of_the...

    Location of the Philippines. The Philippines is a sovereign island country in Southeast Asia situated in the western Pacific Ocean. It is a founding member of the United Nations, World Trade Organization, Association of Southeast Asian Nations, the Asia-Pacific Economic Cooperation forum, and the East Asia Summit.

  9. List of largest companies in the Philippines - Wikipedia

    en.wikipedia.org/wiki/List_of_largest_companies...

    This list is based on the Forbes Global 2000, which ranks the world's 2,000 largest publicly traded companies. The Forbes list takes into account a multitude of factors, including the revenue, net profit, total assets and market value of each company; each factor is given a weighted rank in terms of importance when considering the overall ...