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The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
Calculating thermal conductance is crucial for designing effective heat sinks and cooling systems in electronic devices. Automotive design: Automotive engineers use thermal resistance to optimize the cooling system and prevent overheating in engines and other vehicle components. Evaluating thermal resistance helps in designing engine components ...
The most common design of a heat sink is a metal device with many fins. The high thermal conductivity of the metal combined with its large surface area result in the rapid transfer of thermal energy to the surrounding, cooler, air. This cools the heat sink and whatever it is in direct thermal contact with.
In a cross-flow, in which one system, usually the heat sink, has the same nominal temperature at all points on the heat transfer surface, a similar relation between exchanged heat and LMTD holds, but with a correction factor. A correction factor is also required for other more complex geometries, such as a shell and tube exchanger with baffles.
The thermal conductivity of a material is a measure of its ability to conduct heat.It is commonly denoted by , , or and is measured in W·m −1 ·K −1.. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.
Open cavities are defined as the regions formed between adjacent fins and stand for the essential promoters of nucleate boiling or condensation. These cavities are usually utilized to extract heat from a variety of heat generating bodies. From 2004 until now, many researchers have been motivated to search for the optimal design of cavities. [2]
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
Typical LED package including thermal management design Thermal animation of a high powered A19 sized LED light bulb, created using high resolution computational fluid dynamics (CFD) analysis software, showing temperature contoured LED heat sink and flow trajectories Thermal animation of a high power density industrial PAR 64 LED downlight heat sink design, created using high resolution CFD ...
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