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  2. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    The most common design of a heat sink is a metal device with many fins. The high thermal conductivity of the metal combined with its large surface area result in the rapid transfer of thermal energy to the surrounding, cooler, air. This cools the heat sink and whatever it is in direct thermal contact with.

  3. Thermal management of high-power LEDs - Wikipedia

    en.wikipedia.org/wiki/Thermal_management_of_high...

    Typical LED package including thermal management design Thermal animation of a high powered A19 sized LED light bulb, created using high resolution computational fluid dynamics (CFD) analysis software, showing temperature contoured LED heat sink and flow trajectories Thermal animation of a high power density industrial PAR 64 LED downlight heat sink design, created using high resolution CFD ...

  4. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  5. Building performance simulation - Wikipedia

    en.wikipedia.org/wiki/Building_performance...

    The objective of building performance simulation is the quantification of aspects of building performance which are relevant to the design, construction, operation and control of buildings. [1] Building performance simulation has various sub-domains; most prominent are thermal simulation, lighting simulation, acoustical simulation and air flow ...

  6. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    Heatsink mounted on a motherboard, cooling the CPU underneath it. This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power ( TDP ), also known as thermal design point , is the maximum amount of heat that a computer component (like a CPU , GPU or system on a chip ) can generate and that its cooling ...

  7. Pinch analysis - Wikipedia

    en.wikipedia.org/wiki/Pinch_analysis

    PinCH - Software for continuous and batch processes including indirect heat recovery loops and energy storages. Free manuals, tutorials, case studies and success stories available; HeatIT - Free (light) version of Pinch Analysis software that runs in Excel - developed by Pinchco, a consultancy company offering expert advice on energy related ...

  8. Generalized Environmental Modeling System for Surfacewaters

    en.wikipedia.org/wiki/Generalized_Environmental...

    GEMSS has been used for ultimate heat sink analyses at Comanche Peak Nuclear Power Plant, and Arkansas Nuclear One.In Pennsylvania it has been applied at PPL Corporation's Brunner Island Steam Electric Station on the lower Susquehanna River, Exelon’s Cromby and Limerick Generating Stations on the Schuylkill River, and at several other electric power facilities.

  9. Thermal conductance and resistance - Wikipedia

    en.wikipedia.org/wiki/Thermal_conductance_and...

    Calculating thermal conductance is crucial for designing effective heat sinks and cooling systems in electronic devices. Automotive design: Automotive engineers use thermal resistance to optimize the cooling system and prevent overheating in engines and other vehicle components. Evaluating thermal resistance helps in designing engine components ...