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According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package.
Moisture sensitivity levels are specified in technical standard IPC/JEDEC Moisture/reflow Sensitivity Classification for Nonhermetic Surface-Mount Devices. [1] The times indicate how long components can be outside of dry storage before they have to be baked to remove any absorbed moisture. MSL 6 – Mandatory bake before use; MSL 5A – 24 hours
IPC is a global trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.
This standard codified information from, among other sources, a United States military standard MIL-STD-16 which dates back to at least the 1950s in American industry. To replace IEEE 200-1975, ASME, a standards body for mechanical engineers, initiated the new standard ASME Y14.44-2008. This standard, along with IEEE 315-1975, provide the ...
In both JS-001-2012 and MIL-STD-883H the charged human body is modeled by a 100 pF capacitor and a 1500 ohm discharging resistance. During testing, the capacitor is fully charged to several kilovolts (2 kV, 4 kV, 6 kV and 8 kV are typical standard levels) and then discharged through the resistor connected in series to the device under test.
For what it's worth, the IPC (general industry and military standard) J-STD-001 Handbook says that ROM1 fluxes (Kester RA "44") do not need to be cleaned for class 1 electronics: consumer electronics that will not cause major loss of money or life if they fail.
Solder pastes are classified based on the particle size by IPC standard J-STD 005. [3] The table below shows the classification type of a paste compared with the mesh size and particle size. [ 4 ] Some suppliers use proprietary particle size descriptions, Henkel/Loctite descriptions are given for comparison.
The MIL-PRF-38534 specification establishes the general performance requirements for hybrid microcircuits (hybrid integrated circuit), multi-chip modules (MCM) and, similar devices and the verification and validation requirements for ensuring that these devices meet the applicable performance requirements.
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