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  2. Die singulation - Wikipedia

    en.wikipedia.org/wiki/Die_singulation

    The size of the die left on the tape may range from 35 mm on a side (very large) to 0.1 mm square (very small). The die created may be any shape generated by straight lines, but they are typically rectangular or square-shaped. In some cases they can be other shapes as well depending on the singulation method used.

  3. Elastic therapeutic tape - Wikipedia

    en.wikipedia.org/wiki/Elastic_therapeutic_tape

    Elastic therapeutic tape used for lower back pain on an older male. The product is a type of thin, elastic cotton tape that can stretch up to 140% of its original length. [12] As a result, if the tape is applied stretched greater than its normal length, it will "recoil" after being applied and therefore create a pulling force on the skin.

  4. Die preparation - Wikipedia

    en.wikipedia.org/wiki/Die_preparation

    Wafer glued on blue tape and cut into pieces, with some individual dies removed. Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing.

  5. Tap Root Manuscript - Wikipedia

    en.wikipedia.org/wiki/Tap_Root_Manuscript

    Tap Root Manuscript is the sixth studio album recorded by Neil Diamond, released in October 1970.It was one of the most experimental albums he ever recorded, featuring rock music fused with prominent African sounds and instruments.

  6. KT88 - Wikipedia

    en.wikipedia.org/wiki/KT88

    The KT88 was introduced by GEC in 1956 as a larger variant of the KT66.It was manufactured in the U.K. by the MOV (Marconi-Osram Valve) subsidiary of G.E.C, also labelled as IEC/Mullard, and, in the U.S., Genalex Gold Lion.

  7. Dicing tape - Wikipedia

    en.wikipedia.org/wiki/Dicing_tape

    Dicing tape can be made of PVC, polyolefin, or polyethylene backing material with an adhesive to hold the wafer or substrate in place. In some cases dicing tape will have a release liner that will be removed prior to mounting the tape to the backside of the wafers, with a variety of adhesive strengths, designed for various wafer/substrate sizes and materials.

  8. DECtape - Wikipedia

    en.wikipedia.org/wiki/DECtape

    This meant a "drop-out" on one channel could be tolerated; even a hole punched through the tape with a 0.25 in (6.4 mm) hole punch will not cause the read to fail. [ 14 ] Another reason for DECtape's unusually high reliability is the use of laminated tape: the magnetic oxide is sandwiched between two layers of mylar , rather than being on the ...

  9. Blanking and piercing - Wikipedia

    en.wikipedia.org/wiki/Blanking_and_piercing

    A typical compound fine blanking press includes a hardened die punch (male), the hardened blanking die (female), and a guide plate of similar shape/size to the blanking die. The guide plate is the first applied to the material, impinging the material with a sharp protrusion or stinger around the perimeter of the die opening. Next, a counter ...