Search results
Results from the WOW.Com Content Network
Active cooling is a heat-reducing mechanism that is typically implemented in electronic devices and indoor buildings to ensure proper heat transfer and circulation from within. Unlike its counterpart passive cooling, active cooling is entirely dependent on energy consumption in order to operate. It uses various mechanical systems that consume ...
Thermal simulations give engineers a visual representation of the temperature and airflow inside the equipment. Thermal simulations enable engineers to design the cooling system; to optimise a design to reduce power consumption, weight and cost; and to verify the thermal design to ensure there are no issues when the equipment is built.
Thermoelectric cooling uses the Peltier effect to create a heat flux at the junction of two different types of materials. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current.
This is generally known as Thermal Throttling in the case of reduction of clock speeds, or Thermal Shutdown in the case of a complete shutdown of the device or system. Cooling may be designed to reduce the ambient temperature within the case of a computer, such as by exhausting hot air, or to cool a single component or small area (spot cooling).
The EATCS is capable of rejecting up to 70 kW, and provides a substantial upgrade in heat rejection capacity from the 14 kW capability of the Early External Active Thermal Control System (EEATCS) via the Early Ammonia Servicer (EAS), which was launched on STS-105 and installed onto the P6 Truss.
A chilled beam is a type of radiation/convection HVAC system designed to heat and cool large buildings through the use of water. [1] This method removes most of the zone sensible local heat gains and allows the flow rate of pre-conditioned air from the air handling unit to be reduced, lowering by 60% to 80% the ducted design airflow rate and the equipment capacity requirements.
Pillow Cube Side Cube $ at Amazon. Pillow Cube Side Cube $ at Pillow Cube. The Side Cube ($69.99), also called the Side Sleeper Pillow, measures 12 x 24 x 5 inches, comes in a square, prism-like ...
Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).