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AMSTERDAM (Reuters) -Taiwanese chipmaker TSMC does not necessarily need to use ASML's next generation "High NA EUV" machines for an upcoming generation of chip manufacturing technology called A16 ...
Meanwhile, Intel is looking to use high-NA EUV technology in production in 2027. It will be interesting to see if TSMC is willing to give Intel such a big head start in using high-NA EUV ...
But the company has called 2024 a transition year as it moves to its next-generation high-NA EUV technology. This transition appears to have slowed some orders. ... TSMC, meanwhile, has also ...
Beyond high-NA, ASML in 2024 announced plans for the development of a hyper-NA EUV tool with an NA beyond 0.55, such as an NA of 0.75 or 0.85. [329] [330] These machines could cost USD 720 million each and are expected to be available in 2030. [33] A problem with Hyper-NA is polarization of the EUV light causing a reduction in image contrast ...
ASML is working on the next generation of EUV systems, with the first shipments for R&D purposes shipped to Intel in December 2023, and TSMC in late 2024. [19] [20] The platform is designated High-NA as it increases the numerical aperture (NA) from 0.33 to 0.55, [17] and each system costs approximately $370 million. [2] [20]
TSMC was the first foundry to market 7-nanometre and 5-nanometre (used by the 2020 Apple A14 and M1 SoCs, the MediaTek Dimensity 8100, and AMD Ryzen 7000 series processors) production capabilities, and the first to commercialize ASML's extreme ultraviolet (EUV) lithography technology in high volume.
ASML has orders for more than a dozen, though TSMC, its biggest customer for EUV equipment, has said it does not need to use High NA tools for its A16 chips, expected to enter production in 2025 ...
With the further development of the EUV lithography process to High-NA-EUV lithography, Carl Zeiss SMT will soon also enable the semiconductor industry to realize the next generation of microchips: High-NA-EUV lithography enables light from a larger angular range to be used for imaging, allowing up to three times more structures to be imaged on ...