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  2. Package cushioning - Wikipedia

    en.wikipedia.org/wiki/Package_cushioning

    Cushions can be thought of as performing like springs. Depending on cushion thickness and load-bearing area and on the forcing vibration frequency, the cushion may 1) not have any influence on input vibration, 2) amplify the input vibration at resonance, or 3) isolate the product from the vibration. Proper design is critical for cushion ...

  3. Foam peanut - Wikipedia

    en.wikipedia.org/wiki/Foam_peanut

    They are shaped to interlock when compressed and free flow when not compressed. They are roughly the size and shape of an unshelled peanut and commonly made of expanded polystyrene foam. 50–75 millimetres (2-3 in) of peanuts are typically used for cushioning and void filling packaging applications. The original patent was filed for by Robert ...

  4. PackML - Wikipedia

    en.wikipedia.org/wiki/Packml

    PackML (Packaging Machine Language) is an industry technical standard for the control of packaging machines, as an aspect of industrial automation.. PackML was created by the Organization for Machine Automation and Control (OMAC) in conjunction with the International Society of Automation (ISA).

  5. Drug packaging - Wikipedia

    en.wikipedia.org/wiki/Drug_packaging

    Example pharmaceutical packaging line. All aspects of pharmaceutical production, including packaging, are tightly controlled and have regulatory requirements. Uniformity, cleanliness , sterility, and other requirements are needed to maintain Good Manufacturing Practices. Product safety management is vital.

  6. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    The metric codes still represent the dimensions in mm, even though the imperial size codes are no longer aligned. Problematically, some manufacturers are developing metric 0201 components with dimensions of 0.25 mm × 0.125 mm (0.0098 in × 0.0049 in), [ 31 ] but the imperial 01005 name is already being used for the 0.4 mm × 0.2 mm (0.0157 in ...

  7. Fan-out wafer-level packaging - Wikipedia

    en.wikipedia.org/wiki/Fan-out_wafer-level_packaging

    This is known as a chip-first flow. Panel level packaging uses a large panel instead of a wafer to carry out the packaging process. [6] High end fan-out packages are those with lines and spaces narrower than 8 microns. [4] Fan-out packages can also have several dies, [5] and passive components. [6]

  8. Cellular manufacturing - Wikipedia

    en.wikipedia.org/wiki/Cellular_manufacturing

    The goal of cellular manufacturing is to move as quickly as possible, make a wide variety of similar products, while making as little waste as possible. Cellular manufacturing involves the use of multiple "cells" in an assembly line fashion. Each of these cells is composed of one or multiple different machines which accomplish a certain task.

  9. Cell bank - Wikipedia

    en.wikipedia.org/wiki/Cell_bank

    A cell bank is a facility that stores cells of specific genome for the purpose of future use in a product or medicinal needs, but can also describe the entity of stored cells itself. Cell banks often contain expansive amounts of base cell material that can be utilized for various projects.