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  2. Comparison of Intel processors - Wikipedia

    en.wikipedia.org/wiki/Comparison_of_Intel_processors

    Some Xeon Phi processors support four-way hyper-threading, effectively quadrupling the number of threads. [1] Before the Coffee Lake architecture, most Xeon and all desktop and mobile Core i3 and i7 supported hyper-threading while only dual-core mobile i5's supported it.

  3. Tiger Lake - Wikipedia

    en.wikipedia.org/wiki/Tiger_Lake

    The Tiger Lake-H35 processors were launched on January 11, 2021. These quad-core processors are designed for "ultraportable gaming" laptops with 28-35 W TDP. [ 12 ] Intel officially launched the 11th generation Intel Core-H series and Xeon W-11000M series on May 11, 2021 [ 13 ] and announced the 11th generation Intel Core Tiger Lake Refresh ...

  4. Alder Lake - Wikipedia

    en.wikipedia.org/wiki/Alder_Lake

    While the desktop Alder Lake processors were already on the market by January 2022, the mobile processors were not, although release was expected early that year. Starting cost were USD $289 for the Core i5-12600K. Gracemont was the name given to the efficiency cores, while Golden Cove cores were set for tasks such as gaming and video ...

  5. LGA 1200 - Wikipedia

    en.wikipedia.org/wiki/LGA_1200

    LGA 1200, also known as Socket H5, is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Comet Lake (10th gen) and Rocket Lake (11th-gen) desktop CPUs, which was released in April 2020.

  6. Coffee Lake - Wikipedia

    en.wikipedia.org/wiki/Coffee_Lake

    Coffee Lake processor die from an i7-8700K with 6 cores. Coffee Lake CPUs are built using the second refinement of Intel's 14 nm process (14 nm++). [6] It features increased transistor gate pitch for a lower current density and higher leakage transistors that allows higher peak power and higher frequency at the expense of die area and idle power.

  7. Raptor Lake - Wikipedia

    en.wikipedia.org/wiki/Raptor_Lake

    The processors are connected to PCHs using an OPIO 2.0 x8 interface, except for the HX series which uses a DMI 4.0 x8 interface. [29] Except for the HX series, the processor and PCH are packaged together on a multi-chip package. The HX series uses 45x37.5mm BGA 1964, and the other mobile processors use 25x50mm BGA 1744, on a Type 3 or Type 4 HDI.

  8. Zen 5 - Wikipedia

    en.wikipedia.org/wiki/Zen_5

    Zen 5 was designed with both 4nm and 3nm processes in mind. This acted as an insurance policy for AMD in the event that TSMC's mass production of its N3 nodes were to face delays, significant wafer defect issues or capacity issues.

  9. Intel X99 - Wikipedia

    en.wikipedia.org/wiki/Intel_X99

    Additionally, the X99 chipset supports a configurable layout of the PCI Express 3.0 lanes provided by the processor, which may be configured as up to two ×16 links and one ×8 link, or up to five ×8 links (the total number of available PCI Express 3.0 lanes depends on the processor used). [1] [2]: 4–10, 70, 71 [8] [9]

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