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Immersion cooling is an IT cooling practice by which servers are completely or partially immersed in a dielectric fluid that has significantly higher thermal conductivity than air. Heat is removed from the system by putting the coolant in direct contact with hot components, and circulating the heated liquid through heat exchangers .
Close Coupled Cooling is a last generation cooling system particularly used in data centers. The goal of close coupled cooling is to bring heat transfer closest to its source: the equipment rack. By moving the air conditioner closer to the equipment rack a more precise delivery of inlet air and a more immediate capture of exhaust air is ensured.
Liquid cooling is also used to remove heat from large buildings by using chillers which transfer the coolant from the evaporator to air handling units, chilled beams and fan coil units inside the building, and to the cooling towers from the condenser if the condenser is liquid-cooled.
Liquid to air heat exchangers (radiators) can be used to cool servers cooled with direct to chip liquid cooling, in order to avoid installation of facility water piping. These heat exchangers can be installed separately from racks, or as a rear door on a rack.
Different liquid cooling techniques are mixed and matched to allow for a fully liquid-cooled infrastructure that captures all heat with water. Different liquid technologies are categorized in 3 main groups, indirect liquid cooling (water-cooled racks), direct liquid cooling (direct-to-chip cooling) and total liquid cooling (complete immersion ...
The latter option, which is the design target of iDataCool, requires a high quality of the heat, which can only be achieved by direct hot-water cooling. One example for direct hot-water cooling is the Aquasar project at ETH Zürich, which is operated at coolant temperatures around 60°C. The aim of iDataCool was to achieve coolant temperatures ...
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This provides a specification not only for ESD metal covers on two sides of VPX boards, but also for forced air, conduction- and liquid-cooling implementations. REDI also addresses spray cooling. To allow for greater power and heat dissipation, REDI includes provision for increased board-to-board spacing and increased board thickness.
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