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The first batches of Araldite epoxy resins, for which the brand is best known, were made in Duxford, England in 1950. [1] Araldite adhesive sets by the interaction of an epoxy resin with a hardener. Mixing an epoxy resin and hardener together starts a chemical reaction that produces heat – an exothermic reaction. [2]
The mixture sets in 4-6 hours and fully cures in up to 15 hours. It can be used as an adhesive, laminate, plug, filler, sealant, or electrical insulator and can be drilled, ground, tapped, machined, sanded, and painted when cured. J-B Kwik is a faster-curing two-part epoxy with medium-temperature resistance up to 300 °F (149 °C).
Liquid versions of hide glue are now available; typically they have urea added to keep the glue liquid at room temperature and to extend drying time. Examples of liquid hide glue are Old Brown Glue or Titebond Liquid Hide. Hide glue does not creep. Hide glue joints are easy to repair, by just heating and adding more hide glue. [7] [8] [9]
Depending on the chemical basis, some adhesive types have limited thermal and chemical resistance and the mechanical properties of the bond are temperature dependent. Therefore, choose a type of adhesive that has been developed to have good thermal and chemical resistance, such as reactive hot melt adhesives.
Too low a temperature can cause the polymeric adhesive to enter its glass state becoming very brittle and reducing adhesion. [14] Raising the temperature, on the other hand, causes the polymer to become more fluid and mobile. As the mobility increases, the polymer adhesion is reduced as the polymer starts to flow as opposed to adhere.
The coated joints are then allowed to stand for between 30 minutes and 72 hours, then the components are brought together under elevated pressure and temperature. The curing process is by condensation and a typical figure for Redux Liquid 775/Powder 775 is 30 minutes at 293 °F (145 °C) under a pressure of 100 psi (690 kPa).
This class also displays lower viscosity at room temperature, but offers significantly higher temperature resistance than the aliphatic epoxy diluents. However, reactivity is rather low compared to other classes of epoxy resin, and high temperature curing using suitable accelerators is normally required.
30 varnished silicon steel foils each of thickness 0.0172 inches (0.4368 mm); density 7.51 g cm −3; measured near a temperature of 358.2 K under pressure in the range 0 — 128 psi: 0 psi 0.433 w m −1 K −1 20 psi 0.807 40 psi 0.965 60 psi 1.04 80 psi 1.10 100 psi 1.18 120 psi 1.24 128 psi 1.26 120 psi 1.26 100 psi 1.22 80 psi 1.18 60 psi ...
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