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[9] [10] On November 15, 2018, SK Hynix announced completion of its first DDR5 RAM chip; running at 5.2 GT/s at 1.1 V. [11] In February 2019, SK Hynix announced a 6.4 GT/s chip, the highest speed specified by the preliminary DDR5 standard. [12] The first production DDR5 DRAM chip was officially launched by SK Hynix on October 6, 2020. [13] [14]
Compression Attached Memory Module (CAMM) is a memory module form factor which uses a land grid array, and developed at Dell by engineer Tom Schnell as a replacement for DIMMs and SO-DIMMs which use edge connectors and had been in use for about 25 years. [1] The first SO-DIMMs were introduced by JEDEC in 1997. [2] [3] [4] [5]
One 64 GiB DDR5-4800 ECC 1.1 V registered DIMM (RDIMM) Example of an unregistered DIMM (UDIMM) Registered memory (also called buffered memory) is computer memory that has a register between the DRAM modules and the system's memory controller. A registered memory module places less electrical load on a memory controller than an unregistered one.
Two types of DIMMs (dual in-line memory modules): a 168-pin SDRAM module (top) and a 184-pin DDR SDRAM module (bottom). Memory modules of SK Hynix. In computing, a memory module or RAM stick is a printed circuit board on which memory integrated circuits are mounted.
a 204-pin pc3-10600 ddr3 so-dimm. A SO-DIMM slot on a computer motherboard . A SO-DIMM (pronounced "so-dimm" / ˈ s oʊ d ɪ m / , also spelled " SODIMM ") or small outline DIMM , is a smaller alternative to a DIMM, being roughly half the physical size of a regular DIMM.
The number of chips is a multiple of 8 for non-ECC modules and a multiple of 9 for ECC modules. Chips can occupy one side (single sided) or both sides (dual sided) of the module. The maximal number of chips per DDR module is 36 (9×4) for ECC and 32 (8x4) for non-ECC. ECC vs non-ECC Modules that have error-correcting code are labeled as ECC.
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