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A heat sink is not a device with the "magical ability to absorb heat like a sponge and send it off to a parallel universe". [2] Natural convection requires free flow of air over the heat sink. If fins are not aligned vertically, or if fins are too close together to allow sufficient air flow between them, the efficiency of the heat sink will ...
The Nusselt number is the ratio of total heat transfer (convection + conduction) to conductive heat transfer across a boundary. The convection and conduction heat flows are parallel to each other and to the surface normal of the boundary surface, and are all perpendicular to the mean fluid flow in the simple case.
Online heat sink calculators from companies such as Novel Concepts, Inc. and at www.heatsinkcalculator.com [7] can accurately estimate forced and natural convection heat sink performance. For more complex heat sink geometries, or heat sinks with multiple materials or multiple fluids, computation fluid dynamics (CFD) analysis is recommended (see ...
is the absolute thermal resistance of the heat sink. The heat flow can be modelled by analogy to an electrical circuit where heat flow is represented by current, temperatures are represented by voltages, heat sources are represented by constant current sources, absolute thermal resistances are represented by resistors and thermal capacitances ...
One-piece finned heat sinks are produced by extrusion, casting, skiving, or milling. ... the second boundary condition is that there is free convection at the tip ...
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
Heatsink mounted on a motherboard, cooling the CPU underneath it. This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power ( TDP ), also known as thermal design point , is the maximum amount of heat that a computer component (like a CPU , GPU or system on a chip ) can generate and that its cooling ...
A laptop computer heat pipe system. A heat pipe is a heat-transfer device that employs phase transition to transfer heat between two solid interfaces. [1]At the hot interface of a heat pipe, a volatile liquid in contact with a thermally conductive solid surface turns into a vapor by absorbing heat from that surface.