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Its predecessor, Windows NT 3.1, only includes an incomplete implementation of TCP/IP based on the AT&T UNIX System V "STREAMS" API.) TCP/IP and IPX/SPX stacks in Windows NT 3.5 are rewritten. [8] NetBIOS over TCP/IP (NetBT) support as a compatibility layer for TCP/IP was introduced as also the Microsoft DHCP and WINS clients and DHCP and WINS ...
The HP 48 is a series of graphing calculators designed and produced by Hewlett-Packard from 1990 until 2003. [1] The series includes the HP 48S, HP 48SX, HP 48G, HP 48GX, and HP 48G+, the G models being expanded and improved versions of the S models.
IEEE 802.3 is a working group and a collection of standards defining the physical layer and data link layer's media access control (MAC) of wired Ethernet.The standards are produced by the working group of the Institute of Electrical and Electronics Engineers (IEEE).
This is a list of countries by IPv4 address allocation.. The Internet Assigned Numbers Authority (IANA) distributes large blocks of addresses to regional Internet registries (RIRs), which then assign them to national Internet registries and local Internet registries within their respective service regions. [1]
The Saturn hardware is a nibble serial design [4] as opposed to its Nut predecessor, which was bit-serial. [5] Internally, the Saturn CPU has four 4-bit data buses that allow for nearly 1-cycle per nibble performance with one or two buses acting as a source and one or two acting as a destination. [4]
Windows NT 3.51 is a major release of the Windows NT operating system developed by Microsoft and oriented towards businesses. It is the third version of Windows NT and was released on May 30, 1995, eight months following the release of Windows NT 3.5.
Scientific notation is a way of expressing numbers that are too large or too small to be conveniently written in decimal form, since to do so would require writing out an inconveniently long string of digits.
[22] [23] At least one semiconductor company, LSI, re-sells TSMC wafers through its ASIC design services and design IP portfolio. [dubious – discuss] TSMC has a global capacity of about thirteen million 300 mm-equivalent wafers per year as of 2020 and produces chips for customers with process nodes from 2 microns to 3 nanometres.