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Polycaprolactones impart good resistance to water, oil, solvent and chlorine to the polyurethane produced. This polymer is often used as an additive for resins to improve their processing characteristics and their end use properties (e.g., impact resistance ).
In packaging, it is used for package fabrication such as forming tubes from flexible materials, attaching plastic closures to package forms, etc. Perhaps the most common use of induction sealing is cap sealing , a non-contact method of heating an inner seal [ 1 ] [ 2 ] to hermetically seal the top of plastic and glass containers.
Tritan, a copolymer offered by the Eastman Chemical Company since 2007, is a transparent plastic intended to replace polycarbonate, because of health concerns about Bisphenol A (BPA). [1] [2] Tritan is a copolymer made from three monomers: dimethyl terephthalate (DMT), cyclohexanedimethanol (CHDM), and 2,2,4,4-Tetramethyl-1,3-cyclobutanediol ...
1/n [oc(oc 6 h 4) 2 cme 2] n + h 2 o → (hoc 6 h 4) 2 cme 2 + co 2 More than 100 studies have explored the bioactivity of bisphenol A derived from polycarbonates. Bisphenol A appeared to be released from polycarbonate animal cages into water at room temperature and it may have been responsible for enlargement of the reproductive organs of ...
The C–Si bond is somewhat polarised towards carbon due to carbon's greater electronegativity (C 2.55 vs Si 1.90), and single bonds from Si to electronegative elements are very strong. [14] Silicon is thus susceptible to nucleophilic attack by O − , Cl − , or F − ; the energy of an Si–O bond in particular is strikingly high.
A hermetic seal is any type of sealing that makes a given object airtight (preventing the passage of air, oxygen, or other gases).The term originally applied to airtight glass containers but, as technology advanced, it applied to a larger category of materials, including metals, rubber, and plastics.
Direct bonding, or fusion bonding, is a wafer bonding process without any additional intermediate layers. It is based on chemical bonds between two surfaces of any material possible meeting numerous requirements. [1] These requirements are specified for the wafer surface as sufficiently clean, flat and smooth.
Solvent bonding differs from adhesive bonding, because the solvent does not become a permanent addition to the joined substrate. [4] Solvent bonding differs from other plastic welding processes in that heating energy is generated by the chemical reaction between the solvent and thermoplastic, and cooling occurs during evaporation of the solvent.