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2. Nickel electroplating - Wikipedia

   en.wikipedia.org/wiki/Nickel_electroplating

   Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [3] To clean and protect the part during the plating process, a combination of heat treating, cleaning, masking, pickling, and etching may be used. [1]

3. The Crane Group Companies - Wikipedia

   en.wikipedia.org/wiki/The_Crane_Group_Companies

   The Crane Group Companies (also known as Crane Group) of Columbus, Ohio, USA, is a holding company of operating units primarily involved in the manufacturing and distribution of building products. Products include wood composite decking and railing, exterior cladding products, vinyl fencing, OEM PVC profiles, wood doors and door-frames, and ...

4. Hexion - Wikipedia

   en.wikipedia.org/wiki/Hexion

   Hexion Inc. or Hexion (previously Momentive Specialty Chemicals) [2] is a chemical company based in Columbus, Ohio. It produces thermoset resins and related technologies and specialty products. Hexion is organized into two divisions: the Epoxy, Phenolic and Coating Resins Division, and the Forest Products Division.

5. National Register of Historic Places listings in Columbus, Ohio

   en.wikipedia.org/wiki/National_Register_of...

   Jeffrey Manufacturing Company Office Building: Jeffrey Manufacturing Company Office Building: April 12, 2001 : 224 E. 1st Ave., 883 and 895 N. 6th St. Yes: 85 # Johnson-Campbell House: Johnson-Campbell House

6. Core Molding Technologies - Wikipedia

   en.wikipedia.org/wiki/Core_Molding_Technologies

   2011.2, The company introduced Featherlite® SMC, with a 1.43 sp.gr (relative density), lighter than standard-density SMC (1.9 sp.gr). 2012, The company introduced N-sulGuard® SMC to support Ag and Construction Equipment and Electrical markets. [4] 2013.8, the company announced Airilite™, an ultra-low density SMC, about 1.18 sp.gr. [9]

7. Electroless nickel immersion gold - Wikipedia

   en.wikipedia.org/wiki/Electroless_nickel...

   Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.