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Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.
Arctic Alumina is a ceramics-based polysynthetic thermal compound using aluminum oxide as a thermal transfer medium. It is a lower-cost product than Arctic Silver 5. [1] The 2009 BenchmarkReviews.com 80-product review rated Alumina in the Good class, with a B+ "enthusiast grade"; [2] it cooled a test system 10% better than the last-place finisher.
These thermal greases have low electrical conductivity and their volume resistivities are 1.5⋅10 15, 1.8⋅10 11, and 9.9⋅10 9 Ω⋅cm for 860, 8616 and 8617 respectively. The thermal grease 860 is a silicone oil with a Zinc Oxide filler and 8616 and 8617 are synthetic oils with various fillers including Aluminum Oxide and Boron Nitride.
Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
PAN has properties involving low density, thermal stability, high strength and modulus of elasticity. These unique properties have made PAN an essential polymer in high tech. Its high tensile strength and tensile modulus are established by fiber sizing, coatings, production processes, and PAN's fiber chemistry.
UFFI provides little mechanical strength, as the material is weak and brittle. Before its risks were recognized, it was used because it was a cheap, effective insulator with a high R-value and its open-cell structure was a good acoustic insulator. Though it absorbed moisture easily, it regained effectiveness as an insulator when dried. [31]