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  2. Electroless nickel immersion gold - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.

  3. Electroless nickel-phosphorus plating - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    The gold is typically applied by quick immersion in a solution containing gold salts. This process is known in the industry as electroless nickel immersion gold (ENIG). A variant of this process adds a thin layer of electroless palladium over the nickel, a process known by the acronym ENEPIG. [19]

  4. Electroplating - Wikipedia

    en.wikipedia.org/wiki/Electroplating

    Nevertheless, it has some important applications, such as the electroless nickel immersion gold (ENIG) process used to obtain gold-plated electrical contacts on printed circuit boards. Sputtering uses an electron beam or a plasma to eject microscopic particles of the metal onto the substrate in a vacuum.

  5. Electroless deposition - Wikipedia

    en.wikipedia.org/wiki/Electroless_deposition

    Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [19]

  6. Gold plating - Wikipedia

    en.wikipedia.org/wiki/Gold_plating

    Layers of gold thinner than 0.5 μm (0.02 thou) also dissolve completely into the solder, exposing the underlying metal (usually nickel) to the solder. Impurities in the nickel layer can prevent the solder from bonding to it. Electroless nickel plating contains phosphorus. Nickel with more than 8% phosphorus is not solderable.

  7. Nickel electroplating - Wikipedia

    en.wikipedia.org/wiki/Nickel_electroplating

    Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [ 3 ] To clean and protect the part during the plating process, a combination of heat treating , cleaning, masking, pickling , and etching may be used. [ 1 ]

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  9. Category:Printed circuit board manufacturing - Wikipedia

    en.wikipedia.org/wiki/Category:Printed_circuit...

    Electroless nickel immersion gold; Electroless nickel-phosphorus plating; Expansion card; F. Filled via; FR-2; FR-4; G. G-10 (material) H. Hot air solder leveling; I ...

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