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Gold plating is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver (to make silver-gilt), by a chemical or electrochemical (electroplating) process.
The gold(III) chloride can also be dissolved in water in electroless plating wherein the gold is slowly reduced out of solution onto the surface to be gilded. When this technique is used on the second surface of glass and backed with silver, it is known as " Angel gilding ".
Keum-boo (Korean: 금부; also Geumbu, Kum-Boo or Kum-bu—Korean "attached gold") is an ancient Korean gilding technique used to apply thin sheets of gold to silver, to make silver-gilt. Traditionally, this technique is accomplished by first depleting a surface of sterling silver to bring up a thin layer of fine silver.
Plating is a finishing process in which a metal is deposited on a surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for ...
Still from the instructional video "Creating a Mirror on Glass: Silver & Gold" Angel gilding is gilding glass or gold plating by electroless chemical deposition. Gold chloride is dissolved in water, mixed with other chemicals and poured on clean glass that has been treated with stannous chloride. The gold layer is delicate and usually translucent.
A garniture of an ormolu clock and candelabra at the Palace of Versailles in France. Ormolu (/ ˈ ɔːr m ə ˌ l uː /; from French or moulu 'ground/pounded gold') is the gilding technique of applying finely ground, high-carat gold–mercury amalgam to an object of bronze, and objects finished in this way.
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A surface plating of blue gold on karat gold or sterling silver can be achieved by a gold plating of the surface, followed by indium plating, with layer thickness matching the 1:2 atomic ratio. A heat treatment then causes interdiffusion of the metals and formation of the required intermetallic compound.
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