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  2. Nickel electroplating - Wikipedia

    en.wikipedia.org/wiki/Nickel_electroplating

    Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [3] To clean and protect the part during the plating process, a combination of heat treating, cleaning, masking, pickling, and etching may be used. [1]

  3. Electroless nickel-phosphorus plating - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    With hypophosphite, the main reaction that produces the nickel plating yields orthophosphite H 2 PO − 3, elemental phosphorus, protons H + and molecular hydrogen H 2: [1] 2 Ni 2+ + 8 H 2 PO − 2 + 2 H 2 O → 2 Ni 0 (s) + 6 H 2 PO − 3 + 2 H + + 2 P (s) + 3 H 2 (g) This reaction is catalyzed by some metals including cobalt, palladium ...

  4. Electroless nickel immersion gold - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.

  5. Palladium - Wikipedia

    en.wikipedia.org/wiki/Palladium

    Palladium (sometimes alloyed with nickel) is or can be used for component and connector plating in consumer electronics [52] [53] and in soldering materials. The electronic sector consumed 33 tonnes (1.07 million troy ounces) of palladium in 2006, according to a Johnson Matthey report. [54]

  6. Electroless deposition - Wikipedia

    en.wikipedia.org/wiki/Electroless_deposition

    Electroless nickel plating uses nickel salts as the metal cation source and either hypophosphite (H 2 PO 2 −) (or a borohydride-like compound) as a reducer. [6] A side reaction forms elemental phosphorus (or boron) which is incorporated in the coating. The classical deposition methods follows the following steps:

  7. Electrochemical coloring of metals - Wikipedia

    en.wikipedia.org/wiki/Electrochemical_coloring...

    Black nickel plating was developed around 1905, and between the two wars, black chrome plating (first German patent 1929.GP 607, 420), which saw wider use only from the mid-1950s. [14] After the First World War, the first procedures for anodic oxidation and coloring of anodically oxidized aluminium were developed (1923, 1924.DRP. 413876).

  8. Plating - Wikipedia

    en.wikipedia.org/wiki/Plating

    Plating is a finishing process in which a metal is deposited on a surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for ...

  9. Solderability - Wikipedia

    en.wikipedia.org/wiki/Solderability

    Both quantitative and qualitative tests for solderability exist. [6] The two most common testing methods are the 'dip and look' method and wetting balance analysis.In both of these tests, the soldered pieces undergo an accelerated aging process before being tested for solderability, to take into consideration the time a component was in storage prior to mounting to final assembly.

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