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The Ryzen lineup includes Ryzen 3, Ryzen 5, Ryzen 7, Ryzen 9, and Ryzen Threadripper with up to 96 cores. All consumer desktop Ryzens (except PRO models) and all mobile processors with the HX suffix have an unlocked multiplier.
These three models are the Ryzen 5 7600, Ryzen 7 7700, and Ryzen 9 7900, which feature a lower TDP of 65 W, and come bundled with stock coolers, unlike the X-suffix processors. [ 16 ] [ 17 ] The Ryzen 9 7900X3D and 7950X3D processors with 3D V-Cache were released on February 28, 2023, [ 18 ] followed by the Ryzen 7 7800X3D on April 6.
AMD K6: Model 6, Littlefoot 1 No ... Ryzen 5 (7600X) Ryzen 7 (7700X) Ryzen 9 (7900X, 7950X) ... List of AMD Ryzen microprocessors; List of AMD processors with 3D ...
Branding and model Cores ()Clock rate () L3 cache (total) Thermal solution Chiplets Core config [ii] TDP Release date MSRP; Base Boost Ryzen 9 7950X3D: 16 (32) 4.2
Furthermore, the upper-end models such as Ryzen 5 8600G and Ryzen 7 8700G feature "Ryzen AI", which is a neural processing unit (NPU) for artificial intelligence PC applications. [89] AMD claims that the integrated graphics in Ryzen 8000G APUs is capable of playing AAA games such as Cyberpunk 2077 and Far Cry 6 at 1080p low settings.
AMD announced an initial lineup of four models of Ryzen 9000 processors on June 3, 2024, including one Ryzen 5, one Ryzen 7 and two Ryzen 9 models. Manufactured on a 4 nm process, the processors feature between 6 and 16 cores. [33] Ryzen 9000 processors were released in August 2024. Common features of Ryzen 9000 desktop CPUs: Socket: AM5.
Models with Zen 4c cores (codenamed Phoenix 2) support 14 PCIe 4.0 lanes, while models without them support 20 lanes. 4 of the lanes are reserved as link to the chipset. Includes integrated RDNA 3 GPU. Includes XDNA AI Engine (Ryzen AI) on models without Zen 4c cores. Fabrication process: TSMC 4 nm FinFET.
AMD uses a single Promontory 21 chipset for all configurations that include a chipset. A single Promontory 21 chip provides four SATA III ports and twelve PCIe 4.0 lanes. Four lanes are reserved for the chipset uplink to the CPU while another four are used to connect to another Promontory 21 chip in a daisy-chained topology for X670, X670E and ...
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