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PlayStation 3's Cell CPU achieves a theoretical maximum of 204.8 GFLOPS in single precision floating point operations and up to 15 GFLOPS double precision. [1] The PS3 has 256 MB ([2]) of Rambus XDR DRAM, clocked at CPU die speed. [1] The PPE has 64 KB ([3]) L1 cache and 512 KB L2 cache, while the SPEs have 2 MB local memory (256 KB per SPE ...
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PlayStation 3 models. The PlayStation 3 (PS3) video game console has been produced in various models during its life cycle. At launch, the PlayStation 3 was available with either a 20 or 60 GB hard disk drive in the US and Japan, respectively— priced from US$499 to US$599; and with either a 40, 60, or 80 GB hard disk drive in Europe, priced ...
Plastic leaded chip carrier (PLCC): square, J-lead, pin spacing 1.27 mm. Quad flat package (QFP): various sizes, with pins on all four sides. Low-profile quad flat-package (LQFP): 1.4 mm high, varying sized and pins on all four sides. Plastic quad flat-pack (PQFP), a square with pins on all four sides, 44 or more pins.
System in a package. A system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using package on package, placed side by side, and ...
In fact, due to the earlier release date of the 32-bit version, many of the key features introduced by Service Pack 2 for 32-bit (x86) editions of Windows XP were already present in the RTM version of its 64-bit (x86-64) counterpart. [42] Service Pack 2 is the first and last released service pack for Windows XP Professional x64 Edition.
Three service packs have been released for Windows XP. Service Pack 3 is slightly different, in that it needs at least Service Pack 1 to have been installed, in order to update a live OS. [68] However, Service Pack 3 can still be embedded into a Windows installation disc; SP1 is not reported as a prerequisite for doing so. [69]
GPU and system chipset: 233 MHz "NV2A" ASIC. Co-developed by Microsoft and Nvidia and essentially a variant of Geforce 3 chips. Geometry engine: 115 million vertices per second, 125 million particles per second (peak) 4 pixel pipelines with 2 texture units each. Peak fillrate: Rendering fillrate: 932 megapixels per second (233 MHz × 4 pipelines)