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Lapping. Lapping machine. Lapping is a machining process in which two surfaces are rubbed together with an abrasive between them, by hand movement or using a machine. Lapping often follows other subtractive processes with more aggressive material removal as a first step, such as milling and/or grinding. Lapping can take two forms.
Honing is an abrasive machining process that produces a precision surface on a metal workpiece by scrubbing an abrasive grinding stone or grinding wheel against it along a controlled path. Honing is primarily used to improve the geometric form of a surface, but can also improve the surface finish. Typical applications are the finishing of ...
Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which ...
Surface finish. Surface finish, also known as surface texture or surface topography, is the nature of a surface as defined by the three characteristics of lay, surface roughness, and waviness. [ 1] It comprises the small, local deviations of a surface from the perfectly flat ideal (a true plane ). Surface texture is one of the important factors ...
Flat honing. A flat honing machine. Flat honing is a metalworking grinding process used to provide high quality flat surfaces. It combines the speed of grinding or honing with the precision of lapping. It has also been known under the terms high speed lapping and high precision grinding. [1]
Chemical-mechanical polishing. Chemical mechanical polishing (CMP) (also called chemical mechanical planarization) is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing. [1] It is used in the semiconductor industry to polish ...
Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (IC). ICs are produced on semiconductor wafers that undergo a multitude of processing steps. The silicon wafers predominantly used today have diameters of 200 and 300 mm.
Surface finishing. A drill bit with surface finishing to make the cutting edges harder. Surface finishing is a broad range of industrial processes that alter the surface of a manufactured item to achieve a certain property. [ 1] Finishing processes may be employed to: improve appearance, adhesion or wettability, solderability, corrosion ...