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USB 3.2 Gen 2x1 – newly marketed as SuperSpeed USB 10 Gbps (replaces SuperSpeed+ or SS+), [63] 10 Gbit/s signaling rate over 1 lane using 128b/132b encoding (raw data rate: 1212 MB/s); replaces USB 3.1 Gen 2. USB 3.2 Gen 1x2 – new, 10 Gbit/s signaling rate over 2 lanes using 8b/10b encoding (raw data rate: 1000 MB/s).
The written USB 3.0 specification was released by Intel and its partners in August 2008. The first USB 3.0 controller chips were sampled by NEC in May 2009, [4] and the first products using the USB 3.0 specification arrived in January 2010. [5] USB 3.0 connectors are generally backward compatible, but include new wiring and full-duplex operation.
The xHCI reduces the need for periodic device polling by allowing a USB 3.0 or later device to notify the host controller when it has data available to read, and moves the management of polling USB 2.0 and 1.1 devices that use interrupt transactions from the CPU-driven USB driver to the USB host controller.
A number of extensions to the USB Specifications have progressively further increased the maximum allowable V_BUS voltage: starting with 6.0 V with USB BC 1.2, [50] to 21.5 V with USB PD 2.0 [51] and 50.9 V with USB PD 3.1, [51] while still maintaining backwards compatibility with USB 2.0 by requiring various forms of handshake before ...
USB 3.0 SuperSpeed and USB 2.0 High-Speed versions defined USB 3.0 SuperSpeed – host controller (xHCI) hardware support, no software overhead for out-of-order commands; USB 2.0 High-speed – enables command queuing in USB 2.0 drives; Streams were added to the USB 3.0 SuperSpeed protocol for supporting UAS out-of-order completions
It requires a license from Intel. A USB controller using UHCI does little in hardware and requires a software UHCI driver to do much of the work of managing the USB bus. [2] It only supports 32-bit memory addressing, [4] so it requires an IOMMU or a computationally expensive bounce buffer to work with a 64-bit operating system.
SIMM modules connect to the computer via an 8-bit- or 32-bit-wide interface. RIMM modules used by RDRAM are 16-bit- or 32-bit-wide. [49] DIMM modules connect to the computer via a 64-bit-wide interface. Some other computer architectures use different modules with a different bus width.
The developer forums regulate the development of the USB connector, of other USB hardware, and of USB software; they are not end-user forums. In 2014, the USB-IF announced the availability of USB-C designs. USB-C connectors can transfer data with rates as much as 10 Gbit/s and provides as much as 100 watts of power. [4]