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  2. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    Computer cooling. A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background. A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components. Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.

  3. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The fluid medium is frequently air, but can also be water, refrigerants or oil. If the fluid medium is water, the heat sink is frequently called a cold plate. In thermodynamics a heat sink is a heat reservoir that can absorb an arbitrary amount of heat without significantly changing temperature. Practical heat sinks for electronic devices must ...

  4. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    Placing a conductive thick metal plate, referred to as a cold plate, as a heat transfer interface between a heat source and a cold flowing fluid (or any other heat sink) may improve the cooling performance. In such arrangement, the heat source is cooled under the thick plate instead of being cooled in direct contact with the cooling fluid.

  5. Copper in heat exchangers - Wikipedia

    en.wikipedia.org/wiki/Copper_in_heat_exchangers

    Heat exchangers using copper and its alloys have evolved along with heat transfer technologies over the past several hundred years. Copper condenser tubes were first used in 1769 for steam engines. Initially, the tubes were made of unalloyed copper. By 1870, Muntz metal, a 60% Cu-40% Zn brass alloy, was used for condensers in seawater cooling.

  6. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    Heavy copper layers are used for high current or to help dissipate heat. On the common FR-4 substrates, 1 oz copper per ft 2 (35 μm) is the most common thickness; 2 oz (70 μm) and 0.5 oz (17.5 μm) thickness is often an option. Less common are 12 and 105 μm, 9 μm is sometimes available on some substrates.

  7. Thermoelectric cooling - Wikipedia

    en.wikipedia.org/wiki/Thermoelectric_cooling

    Thermoelectric cooling uses the Peltier effect to create a heat flux at the junction of two different types of materials. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current.

  8. Water cooling - Wikipedia

    en.wikipedia.org/wiki/Water_cooling

    Water cooling is a method of heat removal from components and industrial equipment. Evaporative cooling using water is often more efficient than air cooling. Water is inexpensive and non-toxic; however, it can contain impurities and cause corrosion. Water cooling is commonly used for cooling automobile internal combustion engines and power ...

  9. Power electronic substrate - Wikipedia

    en.wikipedia.org/wiki/Power_electronic_substrate

    Due to its structure, the IMS is a single-sided substrate, i.e. it can only accommodate components on the copper side. In most applications, the baseplate is attached to a heatsink to provide cooling, usually using thermal grease and screws. Some IMS substrates are available with a copper baseplate for better thermal performances.