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  2. Thermal management of high-power LEDs - Wikipedia

    en.wikipedia.org/wiki/Thermal_management_of_high...

    Typical LED package including thermal management design Thermal animation of a high powered A19 sized LED light bulb, created using high resolution computational fluid dynamics (CFD) analysis software, showing temperature contoured LED heat sink and flow trajectories Thermal animation of a high power density industrial PAR 64 LED downlight heat sink design, created using high resolution CFD ...

  3. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    The most common design of a heat sink is a metal device with many fins. The high thermal conductivity of the metal combined with its large surface area result in the rapid transfer of thermal energy to the surrounding, cooler, air. This cools the heat sink and whatever it is in direct thermal contact with.

  4. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  5. Thermal simulations for integrated circuits - Wikipedia

    en.wikipedia.org/wiki/Thermal_simulations_for...

    Electronic systems work based on current and voltage signals. Current is the flow of charged particles through the material and these particles (electrons or holes), interact with the lattice of the crystal losing its energy which is released in form of heat.

  6. Talk:Heat sink - Wikipedia

    en.wikipedia.org/wiki/Talk:Heat_sink

    2 Basic heat sink heat transfer theory model. 3 Methods to determine heat sink thermal performance. 3.1 Heat transfer theoretical model 3.2 Experimental data 3.3 Numerical data 4 Design factors which influence the thermal performance of a heat sink. 4.1 Material 4.1.1 Fin efficiency 4.1.2 Spreading resistance 4.2 Fin arrangements 4.2.1 Pin fin

  7. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).

  8. Pinch analysis - Wikipedia

    en.wikipedia.org/wiki/Pinch_analysis

    PinCH - Software for continuous and batch processes including indirect heat recovery loops and energy storages. Free manuals, tutorials, case studies and success stories available; HeatIT - Free (light) version of Pinch Analysis software that runs in Excel - developed by Pinchco, a consultancy company offering expert advice on energy related ...

  9. Heat spreader - Wikipedia

    en.wikipedia.org/wiki/Heat_spreader

    A heat spreader transfers energy as heat from a hotter source to a colder heat sink or heat exchanger. There are two thermodynamic types, passive and active. The most common sort of passive heat spreader is a plate or block of material having high thermal conductivity, such as copper, aluminum, or diamond. An active heat spreader speeds up heat ...