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2. Multi-chip module - Wikipedia

   en.wikipedia.org/wiki/Multi-chip_module

   A ceramic multi-chip module containing four POWER5 processor dies (center) and four 36 MB L3 cache dies (periphery). A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying ...

3. Three-dimensional integrated circuit - Wikipedia

   en.wikipedia.org/wiki/Three-dimensional...

   A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, [1] [2] so that they behave as a single device to achieve performance ...

4. 5-4-3 rule - Wikipedia

   en.wikipedia.org/wiki/5-4-3_rule

   The standard requires generation of sufficient preamble bits to make sure a frame can be received when operated within specification limits (i.e. applying the 5-4-3 rule). In a lab at DEC they knew how many bits their repeaters would lose and knowing this were able to create an 11 segment, 10 repeater, 3 active segment (11-10-3) network that ...

5. Integrated circuit packaging - Wikipedia

   en.wikipedia.org/wiki/Integrated_circuit_packaging

   Recent developments consist of stacking multiple dies in single package called SiP, for System In Package, or three-dimensional integrated circuit. Combining multiple dies on a small substrate, often ceramic, is called an MCM, or Multi-Chip Module. The boundary between a big MCM and a small printed circuit board is sometimes blurry. [11]

6. Through-silicon via - Wikipedia

   en.wikipedia.org/wiki/Through-silicon_via

   A 3D package (System in Package, Chip Stack MCM, etc.) contains two or more dies stacked vertically so that they occupy less space and/or have greater connectivity. An alternate type of 3D package can be found in IBM's Silicon Carrier Packaging Technology, where ICs are not stacked but a carrier substrate containing TSVs is used to connect ...

7. Block-stacking problem - Wikipedia

   en.wikipedia.org/wiki/Block-stacking_problem

   The first nine blocks in the solution to the single-wide block-stacking problem with the overhangs indicated. In statics, the block-stacking problem (sometimes known as The Leaning Tower of Lire (Johnson 1955), also the book-stacking problem, or a number of other similar terms) is a puzzle concerning the stacking of blocks at the edge of a table.