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Solid Logic Dense (SLD) increased packaging density and circuit performance by mounting the discrete transistors and diodes on top of the substrate and the resistors on the bottom. [3]: 15 SLD voltages were the same as SLT. Unit Logic Device (ULD) use flat-pack ceramic packages, much smaller than SLT's metal cans.
A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.
SOT: Small-outline transistor (also SOT-23, SOT-223, SOT-323). TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes. TO-3: Panel-mount with leads; TO-5: Metal can package with radial leads; TO-18: Metal can package with radial leads; TO-39; TO-46; TO-66: Similar shape to the TO-3 but smaller
The two rows are staggered by 1.27 mm (0.05"), giving them a zig-zag appearance, and allowing them to be spaced more closely than a rectangular grid would allow. The pins are inserted into holes in a printed circuit board, with the packages standing at right-angles to the board, allowing them to be placed closer together than DIPs of the same size.
An electronic kit is a package of electrical components used to build an electronic device. Generally, kits are composed of electronic components, a circuit diagram (schematic), assembly instructions, and often a printed circuit board (PCB) or another type of prototyping board. There are two types of kits. Some build a single device or system.
A reference designator unambiguously identifies the location of a component within an electrical schematic or on a printed circuit board.The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15.
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