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LGA 1200, also known as Socket H5, is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Comet Lake (10th gen) and Rocket Lake (11th-gen) desktop CPUs, which was released in April 2020.
In computer design, microATX (sometimes referred to as μATX, uATX [1] or mATX) [2] is a standard motherboard form factor introduced in December 1997. [3] The maximum size of a microATX motherboard is 9.6 × 9.6 in (244 × 244 mm).
The vast majority of Intel server chips of the Xeon E3, Xeon E5, and Xeon E7 product lines support VT-d. The first—and least powerful—Xeon to support VT-d was the E5502 launched Q1'09 with two cores at 1.86 GHz on a 45 nm process. [2]
Intel i945GC northbridge with Pentium Dual-Core microprocessor. This article provides a list of motherboard chipsets made by Intel, divided into three main categories: those that use the PCI bus for interconnection (the 4xx series), those that connect using specialized "hub links" (the 8xx series), and those that connect using PCI Express (the 9xx series).
An ATX motherboard Comparison of some common motherboard form factors (pen for scale). ATX (Advanced Technology Extended) is a motherboard and power supply configuration specification, patented by David Dent in 1995 at Intel, [1] to improve on previous de facto standards like the AT design.
LGA 1151, [1] also known as Socket H4, is a type of zero insertion force flip-chip land grid array (LGA) socket for Intel desktop processors which comes in two distinct versions: the first revision which supports both Intel's Skylake [2] and Kaby Lake CPUs, and the second revision which supports Coffee Lake CPUs exclusively.
FlexATX is a motherboard form factor derived from ATX.The specification was released in 1999 by Intel as an addendum to the microATX specification. It uses a subset of the motherboard mounting holes required for microATX and the same I/O plate system as ATX and microATX.
Mini-ATX motherboards are a smaller form factor of the ATX motherboards. It typically uses surface-mount technology for component placement, solid state capacitors to ensure stable power delivery, and an 8-layer PCB design to increase durability and longevity. This design is aimed to provide a better overall performance and reliability compared ...
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