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In semiconductor devices, problems in the device package may cause failures due to contamination, mechanical stress of the device, or open or short circuits. Failures most commonly occur near the beginning and near the ending of the lifetime of the parts, resulting in the bathtub curve graph of failure rates.
A system basis chip (SBC) is an integrated circuit that includes various functions of automotive electronic control units (ECU) on a single die. [1] [2] It typically includes a mixture between digital standard functionality like communication bus interfaces and analog or power functionality, denoted as smart power.
More specifically, over time positive charges become trapped at the oxide-semiconductor boundary underneath the gate of a MOSFET. These positive charges partially cancel the negative gate voltage without contributing to conduction through the channel as electron holes in the semiconductor are supposed to. When the gate voltage is removed, the ...
Reliability of a semiconductor device is the ability of the device to perform its intended function during the life of the device in the field. There are multiple considerations that need to be accounted for when developing reliable semiconductor devices: Semiconductor devices are very sensitive to impurities and particles. Therefore, to ...
The earliest electronic systems available as factory installations were vacuum tube car radios, starting in the early 1930s.The development of semiconductors after World War II greatly expanded the use of electronics in automobiles, with solid-state diodes making the automotive alternator the standard after about 1960, and the first transistorized ignition systems appearing in 1963.
ATPG (acronym for both automatic test pattern generation and automatic test pattern generator) is an electronic design automation method or technology used to find an input (or test) sequence that, when applied to a digital circuit, enables automatic test equipment to distinguish between the correct circuit behavior and the faulty circuit behavior caused by defects.
Hot electrons can tunnel out of the semiconductor material, instead of recombining with a hole or being conducted through the material to a collector. Consequent effects include increased leakage current and possible damage to the encasing dielectric material if the hot carrier disrupts the atomic structure of the dielectric.
Iddq testing is a method for testing CMOS integrated circuits for the presence of manufacturing faults. It relies on measuring the supply current (Idd) in the quiescent state (when the circuit is not switching and inputs are held at static values).