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1.344×10 12 GeForce GTX 480 in 2010 from Nvidia at its peak performance; 2.15×10 12: iPhone 15 Pro September 2023 A17 Pro processor; 4.64×10 12: Radeon HD 5970 in 2009 from AMD (under ATI branding) at its peak performance; 5.152×10 12: S2050/S2070 1U GPU Computing System from Nvidia; 11.3×10 12: GeForce GTX 1080 Ti in 2017; 13.7×10 12 ...
Processor / System Dhrystone MIPS or MIPS, and frequency D instructions per clock cycle D instructions per clock cycle per core Year Source LINKS-1 Computer Graphics System (257-processor) 642.5 MIPS at 10 MHz: 2.5: 0.25: 1982 [98] Sega System 16 (4-processor) 16.33 MIPS at 10 MHz: 4.083: 1.020: 1985 [99] Namco System 21 (10-processor) 73.927 ...
iPhone XR: A11 Bionic iPhone X / 8 Plus iOS 16.7.10: 2 GB iPhone 8: A10 Fusion 3 GB LPDDR4 1600 MHz iPhone 7 Plus iOS 15.8.3: 2 GB iPhone 7: A9 iPhone 6s / 6s Plus iPhone SE (1st gen) A8 1 GB LPDDR3 800 MHz eMMC iPhone 6 / 6 Plus iOS 12.5.7 A7 iPhone 5s: A6 LPDDR2 533 MHz iPhone 5 iPhone 5c: iOS 10.3.4 (iPhone 5) iOS 10.3.3 (iPhone 5c) A5 512 ...
The top and side of an iPhone 5S, externally identical to the SE (2016).From left to right, sides: wake/sleep button, silence switch, volume up, and volume down. The touchscreen on the iPhone has increased in size several times over the years, from 3.5 inches on the original iPhone to iPhone 4S, to the current 6.1 and 6.7 inches on the iPhone 14 and 14 Pro series. [1]
The iPhone X contains Apple's A11 Bionic SoC, (system-on-chip) also used in the iPhone 8 and 8 Plus, which is a six-core processor with two cores optimized for performance (25% faster than the A10 Fusion processor), along with four cores optimized for efficiency (70% faster than the previous generation). [45]
Display size Pixel density Acer: Liquid S2 [37] [38] October 2013: Android 4.2 IPS LCD: 1920 × 1080 6.0 in (150 mm) 367 Apple Inc. iPhone 6 Plus: September 2014: iOS 8: IPS LCD: 1920 × 1080 5.5 in (140 mm) 401 Apple Inc. iPhone 6S Plus: September 2015: iOS 9: IPS LCD: 1920 × 1080 5.5 in (140 mm) 401 Apple Inc. iPhone 7 Plus: September 2016 ...
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The A11 is manufactured by TSMC using a 10 nm FinFET process [1] and contains 4.3 billion transistors [7] on a die 87.66 mm 2 in size, 30% smaller than the A10. [12] It is manufactured in a package on package (PoP) together with 2 GB of LPDDR4X memory in the iPhone 8 [2] and 3 GB of LPDDR4X memory in the iPhone 8 Plus [12] and iPhone X. [13] [14]