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A high-pressure sodium street light in Toronto A high-pressure sodium-vapor lamp An HPS lamp that isn't entirely off. A sodium-vapor lamp is a gas-discharge lamp that uses sodium in an excited state to produce light at a characteristic wavelength near 589 nm.
2012 - The Wall Street Journal's 2012 Technology Innovation Awards for SideLighter and aePLASMA; 2012 - R&D 100 Awards for Lignoxy, TEMM, SideLighter, aePLASMA, Light&Light, and AVA-Clamp; 2012 - Aviation Week's A&D SIC Award for REDDEX; 2011 - The Wall Street Journal's 2011 Technology Innovation Awards for i2R e-Paper and Spray-IT
The light is bounced off Zeiss mirrors onto the surface of a silicon wafer to deliver the designs for the chip. [ 15 ] In 2009, the IMEC research center in Belgium produced the world's first functional 22 nm CMOS Static random-access memory memory cells with a prototype EUV lithography machine. [ 16 ]
In electronics, a wafer (also called a slice or substrate) [1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon
There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]
France 3 (French: [fʁɑ̃s tʁwɑ]) is a French free-to-air public television regional network part of the France Télévisions group.. It is made up of a network of regional television services providing daily news programming and around ten hours of entertainment and cultural programming produced for and about the regions each week (similar to ITV in the United Kingdom).
Once tested, a wafer is typically reduced in thickness in a process also known as "backlap", [118]: 6 "backfinish", "wafer backgrind" or "wafer thinning" [191] before the wafer is scored and then broken into individual dies, a process known as wafer dicing. Only the good, unmarked chips are packaged.
[11] [12] The surface of epitaxial wafers may be textured to enhance light absorption. [ 13 ] [ 14 ] In April 2016, the company Crystal Solar of Santa Clara, California , in collaboration with the European research institute IMEC announced that they achieved a 22.5% cell efficiency of an epitaxial silicon cell with an nPERT (n-type passivated ...