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An Automated Optical Inspection device. Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew).
Transistor testers have the necessary controls and switches for making the proper voltage, current and signal settings. A meter with a calibrated "good" and "bad" scale is on the front. In addition, these transistor testers are designed to check the solid-state diodes. There are also testers for checking high transistor and rectifiers.
A common form of in-circuit testing uses a bed-of-nails tester.This is a fixture that uses an array of spring-loaded pins known as "pogo pins". When a printed circuit board is aligned with and pressed down onto the bed-of-nails tester, the pins make electrical contact with locations on the circuit board, allowing them to be used as test points for in-circuit testing.
An LED strip, tape, or ribbon light is a flexible circuit board populated by surface-mount light-emitting diodes (SMD LEDs) and other components that usually comes with an adhesive backing. Traditionally, strip lights had been used solely in accent lighting, backlighting, task lighting, and decorative lighting applications, such as cove lighting .
A reference designator unambiguously identifies the location of a component within an electrical schematic or on a printed circuit board.The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15.
An optical transistor, also known as an optical switch or a light valve, is a device that switches or amplifies optical signals.Light occurring on an optical transistor's input changes the intensity of light emitted from the transistor's output while output power is supplied by an additional optical source.
Non-SMD types of LED lighting also exist, such as COB (chip on board) and MCOB (multi-COB). Surface-mounted device LED modules are described by the dimensions of the LED package. A single multicolor module may have three individual LEDs within that package, one each of red, green and blue, to allow many colors or shades of white to be selected ...
Wafer testing is a step performed during semiconductor device fabrication after back end of line (BEOL) and before IC packaging.. Two types of testing are typically done. Very basic wafer parametric tests (WPT) are performed at a few locations on each wafer to ensure the wafer fabrication process has been carried out successfully.
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