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Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]
Melting the solder can release toxic fumes, particularly solder with higher proportions of lead. It is recommended to work in a well-ventilated area; to avoid inhaling the toxic fumes; and to wash hands with soap after operating with a soldering iron. It is also recommended to use lead-free solder to mitigate the risks of lead exposure. [30] [31]
Used as wire for hand soldering rework; compatible with SnCu 0.7, SnAg 3 Cu 0.5, SnAg 3.9 Cu 0.6, and similar alloys. Used as solder spheres for BGA/CSP components. Used for step soldering and die attachment in high power devices. Established history in the industry. [51] Widely used. Strong lead-free joints.
Common solder alloys include tin-lead, tin-silver, and tin-copper, among others. Lead-free solder has also become more widely used in recent years due to health and environmental concerns associated with the use of lead. In addition to the type of solder used, the temperature and method of heating also play a crucial role in the soldering process.
The more common lead-free solder systems have a higher melting point, e.g. a 30 °C typical difference for tin-silver-copper alloys, but wave soldering temperatures are approximately the same at ~255 °C; [47] however at this temperature most typical lead-free solders have longer wetting times than eutectic Pb/Sn 37:63 solder. [49]
When lead-free solder is used in wave soldering, a slightly modified solder pot may be desirable (e.g. titanium liners or impellers) to reduce maintenance cost due to increased tin-scavenging of high-tin solder. Lead-free solder is prohibited in critical applications, such as aerospace, military and medical projects, because joints are likely ...
Solderability when using lead-free alloys can differ significantly from solderability when using lead based alloys. Noble metals may be easy to solder but they have brittle joints. The metals in the good category require a large amount of heat therefore oxidation is an issue. To overcome this a flux is required.
Solder paste must be refrigerated when transported and stored in an airtight container at a temperature between 0-10 °C. It should be warmed to room temperature for use. Recently, new solder pastes have been introduced that remain stable at 26.5 °C for one year and at 40 °C for one month. [8]
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