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Electroless copper plating is a chemical process that deposits an even layer of copper on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing copper salts and a reducing agent such as formaldehyde .
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Electroless deposition is advantageous in comparison to PVD, CVD, and electroplating deposition methods because it can be performed at ambient conditions. [2] [5] The plating method for Ni-P, Ni-Au, Ni-B, and Cu baths are distinct; however, the processes involve the same approach. The electroless deposition process is defined by four steps: [2 ...
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Copper plating on aluminium. Copper electroplating is the process of electroplating a layer of copper onto the surface of a metal object. Copper is used both as a standalone coating and as an undercoat onto which other metals are subsequently plated. [1]
Electroless nickel plating also can produce coatings that are free of built-in mechanical stress, or even have compressive stress. [ 16 ] A disadvantage is the higher cost of the chemicals, which are consumed in proportion to the mass of nickel deposited; whereas in electroplating the nickel ions are replenished by the metallic nickel anode.
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